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BGA package underfill

BGA package underfill

Categorie
Manifatturiera
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7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China, 510000
Come raggiungere
Contatti
13825524136
www.deepmaterialcn.com/bga-pac...
Chi BGA package underfill
Descrizione
DeepMaterial (Shenzhen) Co., Ltd. is an innovative company specializing in industrial adhesives for semiconductor,home applicance and electronic applications and surface protection materials for chip packaging and testing. Based on the core technolo- gy of adhesives, DeepMaterial has developed industrial adhesives for chip packaging and testing, circuit board-level adhe- sives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing.

Address: 7th Floor, Building C, Comlong Science & Technology Park, Guanlan High-tech Park, Long- hua District, Shenzhen, Guangdong, China
Phone: (+86)-13825524136
Email: info@deepmaterialcn.com
Website: https://www.deepmaterialcn.com/bga-package-underfill.html
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Business in Shenzhen, Cina

Manifatturiera 22 Azienda di elettronica 16 Azienda nel settore delle tecnologie 7 Impresa industriale 5 Vendita all'ingrosso e forniture 3

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